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NTMS7N03R2
MAXIMUM RATINGS (T C = 25 ° C unless otherwise noted)
Rating
Drain?to?Source Voltage
Drain?to?Gate Voltage (R GS = 1.0 M W )
Gate?to?Source Voltage ? Continuous
Thermal Resistance, Junction?to?Ambient (Note 1)
Total Power Dissipation @ T A = 25 ° C
Drain Current ? Continuous @ T A = 25 ° C
Drain Current ? Continuous @ T A = 70 ° C
Drain Current ? Pulsed (Note 4)
Thermal Resistance, Junction?to?Ambient (Note 2)
Total Power Dissipation @ T A = 25 ° C
Drain Current ? Continuous @ T A = 25 ° C
Drain Current ? Continuous @ T A = 70 ° C
Drain Current ? Pulsed (Note 4)
Thermal Resistance, Junction?to?Ambient (Note 3)
Total Power Dissipation @ T A = 25 ° C
Drain Current ? Continuous @ T A = 25 ° C
Drain Current ? Continuous @ T A = 70 ° C
Drain Current ? Pulsed (Note 4)
Operating and Storage Temperature Range
Single Pulse Drain?to?Source Avalanche Energy ? Starting T J = 25 ° C
Symbol
V DSS
V DGR
V GS
R q JA
P D
I D
I D
I DM
R q JA
P D
I D
I D
I DM
R q JA
P D
I D
I D
I DM
T J , T stg
E AS
Value
30
30
± 20
50
2.5
8.5
6.8
25
85
1.47
6.5
5.2
18
156
0.8
4.8
3.8
14
? 55 to +150
288
Unit
Vdc
Vdc
Vdc
° C/W
W
Adc
Apk
° C/W
W
Adc
Apk
° C/W
W
Adc
Apk
° C
mJ
(V DD = 30 Vdc, V GS = 10 Vdc, Peak
I L = 12 Apk, L = 4.0 mH, R G = 25 W )
1.
2.
3.
4.
2 in. Sq. FR?4 PCB mounting, (2 oz. Cu 0.06 in. thick single sided), 10 Sec. Max.
2 in. Sq. FR?4 PCB mounting, (2 oz. Cu 0.06 in. thick single sided), t = steady state.
Minimum FR4 or G10 PCB, t = steady state.
Pulse test: Pulse Width = 300 m s, Duty Cycle = 2%.
ATTRIBUTES
Characteristics
Value
ESD Protection
ORDERING INFORMATION
Device
NTMS7N03R2
NTMS7N03R2G
Human Body Model
Machine Model
Charged Device Model
Package
SOIC?8
SOIC?8
Class 1E
Class A
Class 0
Shipping ?
2500 / Tape & Reel
2500 / Tape & Reel
(Pb?Free)
?For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
2
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